Methods for installing a plurality of circuit devices

ABSTRACT

A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. application Ser. No.10/747,333, filed on Dec. 29, 2003, which is a continuation of U.S.application Ser. No. 09/258,764, filed on Feb. 26, 1999, now U.S. Pat.No. 6,681,480, issued on Jan. 27, 2004.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the installation and support ofelectronic circuits, such as field-installable memory circuits supportedin individual packages such as dice, vertical surface mount packages,lead frame packages and so forth. More particularly, the inventionrelates to a technique for mechanically and electrically installing suchcircuit devices on a support, such as a socket or connector on a printedcircuit board or motherboard.

2. Description of the Related Art

A wide variety of packaging techniques have been proposed and arecurrently in use for supporting and interconnecting electroniccircuitry, such as memory devices, add-on peripheral circuits, upgradecircuit components, and so forth. Such devices typically include anelectronic circuit or circuits formed in or disposed on a support, suchas a semiconductor die. The electronic circuitry on the support isdesigned to function with external circuitry in the ultimateapplication, such as in a personal computer or other electronic device.To enhance the flexibility of the overall circuit design, it isparticularly convenient to provide the separate electronic circuitry inpackages which can be assembled on a supporting socket either duringfactory installation or in the field, such as by end users, localcomponent vendors or service personnel. In such cases, the separatelypackaged circuitry may be designed to be retrofitted or installed onexisting circuit boards as needed such as to further enhance or upgradethe user's system.

Individually packaged circuitry of the type mentioned above may beinstalled in several manners. For example, the installation ofsemiconductor dice may be automated in large scale manufacturingprocesses, particularly when the same or similar circuits are to beadded to a large number of circuit boards. However, for after market oradd-on circuits, such high-speed installation techniques areinappropriate. Rather, in such applications the circuit package istypically shipped and handled individually or in small groups. Vendorsor end users often purchase the circuit packages and individuallyinstall the packages in the final application, such as by pressingconductive leads or pads provided on an edge of the package intocorresponding sockets in a support or interface connector by hand or bymeans of conventional tools, such as tweezers.

Such techniques for installing circuit devices suffer from severalimportant drawbacks. First and perhaps most importantly, the circuitdevice package itself may be quite fragile and easily damaged duringhandling and installation. Similarly, the circuit board and socket onwhich the package is installed may often be easily damaged whenexcessive or improperly-directed force is applied to it duringinstallation. Moreover, increasingly complex add-on circuitry requires alarge number of conductive pads or pins extending from the circuitpackage. These delicate features of the components stand a much greaterrisk of damage to either the circuit package or to the support in whichthe package is installed due, again, to excessive force andmisalignment. In addition, where the circuits are manually handled andinstalled, serious damage to the circuits can result from static chargesinadvertently conveyed to the circuits by the user or service personnel,or from oils present on the installer's hands.

Various approaches have been proposed and are currently in use foraddressing the shortcomings of conventional circuit package installationtechniques. For example, the packages supporting the add-on circuitrymay be constructed in an increasingly robust manner in an attempt toprovide a sturdy framework capable of withstanding handling duringtransport and installation. However, such packaging adds to the size andcost of the circuitry, and may not effectively reduce the risk of damageto the circuit on which the add-on package is installed. Moreover, tothe extent that such techniques still require manual handling andinstallation, risks associated with static charges and oil from handlingmay be equally unavoidable.

There is a need, therefore, for an improved technique for handling andinstalling circuit devices that addresses such drawbacks. In particular,there is a need for an improved system for holding or supporting circuitdevices, particularly fragile devices formed on unprotectedsemiconductor dice, or on dice with limited mechanical protection,during transport, handling and installation. Ideally the technique wouldreduce or eliminate the need to physically handle the circuit packageitself, and would provide for appropriate alignment and securement ofthe circuit package in a socket or connector.

SUMMARY OF THE INVENTION

The present invention provides a technique for installing circuitdevices which is designed to respond to these needs. The techniqueoffers a system both for storing and transporting such devices, as wellas for facilitating their installation in an application. The techniquemay be employed with a variety of device packages, but is particularlywell suited to direct die connect sockets, lead frame packages, and thelike. Moreover, the technique provides a mechanism for storing andinstalling a single such device, and which may be adapted forinstallation of a plurality of similar or different devices in a singleunit.

In a favored approach, the technique employs a holder or case designedto enclose the circuit device during transport. The device holder alsofacilitates placement and alignment of the circuit device forinstallation. Moreover, the device holder permits ejection of the devicefor installation without requiring direct contact or handling by theuser or service personnel. The technique may be further adapted tofacilitate manual installation of a large number of similar devices,such as by vendors, from a tool which stores and ejects a series ofsimilar devices from a stack. In its various embodiments, the techniquemay be employed with custom-designed component packages, or withpackaged circuit devices of conventional design without requiringspecial adaptation of the external configuration of the packages.

Thus, in accordance with a first aspect of the invention, an apparatusis provided for installing an electronic circuit device on a support.The support includes a plurality of first conductive elements. Thedevice has a plurality of second conductive elements disposed adjacentto at least one edge thereof The first conductive elements areconfigured to contact the second conductive elements when the device isinstalled on the support. The apparatus includes a holder and a manuallyactuatable ejector. The holder is configured to receive the device andto align the first conductive elements with the second conductiveelements. The ejector is configured to extend at least partially intothe holder and to urge the device into an installed position wherein thefirst conductive elements contact respective second conductive elements.The ejector may conveniently include a slot in which the device isaligned. The ejector enters into the slot to press the device from theslot and into engagement on the support upon manual actuation of theejector. The holder may also conveniently include a plurality of suchslots to facilitate transportation, storage and installation of acorresponding number of circuit devices.

In accordance with another aspect of the invention, a tool system isprovided for installing a semiconductor device on a receiving support.The device includes a plurality of conductive elements disposed adjacentto an edge thereof. The conductive elements are received by an interfaceregion of the support. The tool system comprises a holder and a manuallyoperated ejector. The holder has side walls forming a cavity forretaining the device. An opening is provided from the cavity fordispensing the device on the support. The ejector is configured at leastpartially to enter into the cavity and to urge the device through theopening onto the interface region. A second opening may conveniently beprovided in the slot for loading or charging the device prior toinstallation. Features may be provided on the holder which cooperatewith registration features on the receiving support to ensure properalignment of the device with the interface region prior to installation.

The ejector may be configured as an elongated tool which receives astack or a series of semiconductor devices. The devices in the stack areurged toward a dispensing slot by a spring mechanism or similararrangement. Upon actuation of the ejector, the device adjacent to theslot is forced through the slot for installation, followed by indexingof the next device in the stack toward the slot for installation.

The invention also provides a method for installing an electroniccircuit device on a support. The circuit device is of the type having aplurality of first conductive elements configured to contact secondconductive elements in an interface region of the support. In accordancewith the method, the circuit device is positioned in a holder, theholder having a recess for receiving the circuit device. The holder isthen positioned on the interface region. The circuit device is manuallyurged from the recess to electrically couple the first conductiveelements to the second conductive elements, thereby installing thecircuit device on the interface region of the support. The holder mayconveniently guide the circuit device from the recess during itsejection therefrom. During the positioning of the holder on theinterface region, registration elements disposed on the holder and thesupport may be mated to properly align the circuit device over theinterface region.

In accordance with a variation on the method, a plurality of circuitdevices are positioned in a dispenser. The dispenser is located on aninterface region of a support. At least one of the circuit devices isthen manually urged from the dispenser onto the interface region. Firstconductive elements on the circuit device thus dispensed are therebybrought into contact with second conductive elements of the support. Thecircuit devices positioned in the dispenser may be convenientlyseparated from one another by partitions formed in the dispenser or maybe positioned in a stack directly contacting one another in thedispenser.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other advantages and features of the invention willbecome apparent upon reading the following detailed description and uponreference to the drawings in which:

FIG. 1 is a perspective view of a circuit device having electricalcontact pads along an edge for installation on a support, such as aprinted circuit board socket;

FIG. 2 is a perspective view of an alternative package design for anelectronic circuit device having conductive leads extending from acircuit support or substrate;

FIG. 3 is a perspective view of a support for securing circuit devicesof the type illustrated in FIGS. 1 and 2 on a circuit board, with aportion of the support broken away to illustrate the arrangement of oneof the circuit devices in the support;

FIG. 3A is a sectional view of a portion of the support illustrated inFIG. 3 along line 3A-3A, illustrating the manner in which the circuitdevice is held within the support;

FIG. 4 is a perspective view of a holder or dispenser for a circuitdevice of the type illustrated in FIG. 3 prior to installation;

FIG. 5 is a perspective view of the holder of FIG. 4 showing a slot fromwhich the circuit device may be ejected, and alignment pins for properlyaligning the circuit device over a support of the type shown in FIG. 3;

FIG. 6 is a perspective view of the holder of FIGS. 4 and 5 positionedover the support of FIG. 3 prior to installation of a circuit devicetherein;

FIG. 7 is a sectional view of the holder positioned as shown in FIG. 6prior to installation of the circuit device;

FIG. 8 is a sectional view of the holder and support of FIG. 7 followinginstallation of the circuit device into the support;

FIG. 9 is a perspective view of an alternative configuration of a holderwherein a plurality of circuit devices may be aligned for installation;

FIG. 10 is a perspective view of the portion of an alternativeconfiguration of a holder and dispenser wherein a series or stack ofcircuit devices may be positioned for sequential installation into asocket or support;

FIG. 11 is a bottom perspective view of a portion of the device of FIG.10, illustrating a slot through which the circuit devices may be ejectedand features for properly aligning the device over a support;

FIG. 12 is a side sectional view of the dispenser of FIG. 10,illustrating an exemplary arrangement for continuously urging thecircuit devices toward the ejection slot; and

FIG. 13 is a sectional view of a portion of the dispenser of FIG. 12,shown in an actuated position for installation of a circuit device in asocket or support.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

Turning now to the drawings, and referring first to FIG. 1, anelectronic circuit device is illustrated and designated generally by thereference numeral 10. Device 10 includes a die 12 in which electroniccircuits are formed by conventional processes. Die 12 is supported on asupport or substrate 14, and is coupled to electrically conductivetraces 16 on the substrate for transmitting power and data signalsbetween circuitry formed in the die and external circuitry. Certain ofthe conductive traces 16 terminate in conductive pads 18 disposed alongone or more edges 20 of substrate 14. In addition to die 12 andconductive traces 16, substrate 14 may include additional circuitryformed on or within a multi-layer structure, or supported on substrate14. Thus, substrate 14 may include prepackaged surface components 22designed to electrically interface with circuitry on or in the substrateitself or formed in die 12. Moreover, as will be appreciated by thoseskilled in the art, device 10 may include external packaging orenclosures designed to partially or completely cover die 12 or anysurface components mounted thereon.

FIG. 2 illustrates an alternative configuration of an electronic device10 which may also be mounted in accordance with the techniques describedbelow. In the embodiment of FIG. 2, a die 12 is supported on a supportor substrate 14. However, rather than the conductive pads or traces 18of the embodiment of FIG. 1, the device illustrated in FIG. 2 includesone or more intermediate layers 24 formed in substrate 14 from which aplurality of conductive contact pins 26 extend. Pins 26 may extend fromone or more edges of the device, or may originate in a face of thedevice rather than in the edge 20 as illustrated in FIG. 2. As will alsobe appreciated by those skilled in the art, while the embodiments ofFIGS. 1 and 2 include a relatively small number of contact pads or pinsfor connecting circuitry of die 12 to external circuitry, in certainapplications a large number of such contact elements may be provided, inone or more rows or in an array, or on both front and rear sides of asupport or substrate, such as a laminated circuit board.

FIG. 3 illustrates an exemplary support for receiving an electronicdevice of the type illustrated in FIGS. 1 and 2 and for completingelectrical connections between such devices and external circuitry. Asshown in FIG. 3, support 30 is designed to be mounted on andelectrically interfaced with an external circuit board such as a systemboard, mother board, and so forth as indicated at reference numeral 32.Board 32 will typically include conductive traces and circuit componentsdesigned to exchange signals with one or more electronic devices 10mounted within support 30. For example, board 32 may include a motherboard in a computer system, and device 10 a solid state memory device,such as a DRAM or other memory configuration.

Support 30 includes an insulative body 34 having side walls 36 and aseries of partitions 38 defining sockets 40. Sockets 40 extend over theentire height of body 34 and are designed to receive and support devices10, and to guide the devices into engagement with external circuitry asdescribed more fully below. In the exemplary embodiment of FIG. 3, fivesuch sockets are illustrated in body 34. However, depending upon theexigencies of particular applications, more or fewer such sockets may beprovided. Moreover, while sockets 40 are illustrated in a generallyparallel arrangement, other arrangements may be envisaged, such as aplurality of sockets arranged in rows or in a matrix. Each socket 40includes features for facilitating proper registration of an insertiontool for installing electronic devices. In the illustrated embodiment,such registration features include a pair of registration recesses 42adjacent to each socket 40. At the base of each socket 40, an electricalsocket 44 is provided (see FIG. 3A). Electrical socket 44 includes aplurality of electrically conductive elements 46 designed to contacteach of the conductive pads 18 (or pins 26) of device 10 upon properinstallation of the device into support 30. In practice, conductiveelements 46 will provide continuity to external circuitry supported onboard 32 or on external boards or system components in a mannergenerally known in the art.

A presently preferred tool or dispenser for installing devices 10 in asupport 30 of the type illustrated in FIG. 3 is shown in FIGS. 4 and 5.As illustrated in those figures, the dispenser 48 may be configured tosupport a single electronic device designed to be installed in a singlesocket of the support. The dispenser includes a case or shell 50 whichis designed to receive and hold the electronic device and to protect theelectronic device during transport and handling. Shell 50 forms acentral slot or recess 52 extending completely therethrough and formingan upper opening 54 and a lower opening 56 (see FIG. 5). Device 10 maybe inserted into slot 52 through either upper opening 54 or loweropening 56. A lower face 58 of shell 50 includes features for insuringproper alignment and registration of the dispenser for installation of acircuit device. In the illustrated embodiment, such features include apair of registration pins 60 disposed at lateral positions adjacent tolower opening 56. Internal walls 62 of shell 50 surround slot 52 tocontact and guide device 10 during translation therein, as describedbelow, for installation. Moreover, retaining projections 64 are formedadjacent to upper and lower openings 54 and 56 to exert a slightretaining force on device 10 when inserted into slot 52 and thereby toprevent the device from sliding from the slot prematurely.

Dispenser 48 also includes an actuator 66 for urging device 10 into aninstalled position within support 30. In the illustrated embodiment,actuator 66 includes a panel 68 of slightly smaller dimensions than slot52 such that panel 68 may be pressed into slot 52 to urge the devicecontained therein into the support.

Installation of a device 10 into a support 30 by means of a dispenser ofthe type shown in FIGS. 4 and 5 is illustrated in FIGS. 6, 7, 7A, and 8.As shown in FIGS. 6 and 7, the installation begins with placement of thedispenser in registration over a desired support socket 40. A device 10is loaded within the dispenser and the actuator is placed over an upperend of the device as shown. It should be noted that in this position,device 10 is retained by projections 64 at the upper and lower ends ofslot 52. In practice, device 10 may be prepackaged in shell 50, shippedwith the shell, and field installed as illustrated in FIGS. 7 and 8. Asshown in FIG. 7, in the illustrated embodiment registration of thedevice over a socket of body 34 is facilitated by engagement ofregistration pins 60 in registration recesses 42. Thereafter, actuator68 is depressed against device 10 as indicated by arrow 70 in FIG. 7.The force exerted on actuator 66 is sufficient to overcome interferencewith lower retaining projections 64, and device 10 is thus guided intosocket 40 as shown in FIG. 8. Upon full engagement of the device in thesocket, conductive pads 18 (or other structures such as pins 26) comeinto full contact and electrical engagement with conductive elements 46of the electrical socket 44 to complete connections between device 10and external circuitry. Thereafter dispenser 48 may be removed fromsupport 30 and, where desired, discarded. Alternatively, dispenser 48may be made reusable, so as to receive and dispense subsequent devicesinstalled within shell 50 as described above.

FIG. 9 represents an alternative embodiment for an exemplary dispenser,designated generally by the reference numeral 72. Dispenser 72 is formedas a multi-device holder having a body or shell 74 and a plurality ofpartitions 76 separating independent device-receiving slots 78. Slots 78are designed to receive and retain circuit devices 10 by means ofretaining features such as projections 64 of the type described abovewith respect to the embodiment of FIGS. 5 through 8. Similarly,alignment or registration features are preferably formed on holder 72,such as registration pins 60 provided adjacent to each slot 78. Themulti-device dispenser of FIG. 9 may be utilized to hold, transport, anddispense a plurality of similar or different devices positioned withinslots 78, such as by means of an actuator 66 of the type describedabove. It should be noted, however, that other device configurations maybe provided in the plurality of slots within the holder of FIG. 9,particularly where different chip sets are desired to be installed in asingle sequence of operations, and are conveniently transported andstored as a collection of components. For installation, the dispenser ofFIG. 9 is positioned over a support, such as the support 30 illustratedin FIG. 6, and the individual devices are installed in appropriatelocations in the support as described above for the individual devicedispenser 48.

The present technique may also be adapted for installation of aplurality of electronic devices as illustrated particularly in FIGS. 10,11, 12, and 13. In this alternative embodiment, a group dispenser 80 isdesigned to receive a number of electronic devices 10 in a holder ortray 82. The devices are aligned and retained in the tray and areadvanced to an installation position for insertion into a retainingsocket in a sequential manner. To urge the individual devices into theretaining and support socket, an actuator 84 is disposed adjacent totray 82, and is displaceable with respect to the tray to urge thedevices into their installed position. Accordingly, tray 82 includessidewalls 86 and an endwall 88 for guiding and aligning devices 10therein. A base 90 (see FIG. 11) serves as a support for the devices asthey are translated sequentially within tray 82. A forward slot 92 isformed in base 90 to permit ejection of devices 10 from tray 82 overreceiving sockets in a support. As shown in FIG. 11, alignment orregistration features are preferably formed on base 90 to ensure properalignment of slot 92 over a receiving socket. In the illustratedembodiment, such features include registration pins 94 disposedlaterally adjacent to slot 92.

Various configurations of actuators may be envisaged for dispensingindividual devices 10 from tray 82. In the illustrated embodiment,actuator 84 includes an upper panel 96 and a contiguous ejector panel98. Upper panel 96 may be depressed under manual power to urge ejectorpanel 98 into contact with an individual device 10 to eject the devicethrough slot 92.

As best illustrated in FIG. 12, installation of devices 10 proceeds byfirst loading the devices within the dispenser in a stacked arrangement.A sliding plate or backstop 100 contacts the devices to hold them inengagement and to urge them sequentially toward slot 92. In theillustrated embodiment, a compression spring 102 disposed about atelescoping rod structure (not shown) serves to maintain a compressiveforce urging the devices toward slot 92. Actuator 84 is retained abovetray 82, such as by means of a hinge or pivot pin 104. A biasing spring(not shown) may be provided to maintain actuator 84 in a raised orbiased position as illustrated in FIG. 12.

Once dispenser 80 is properly positioned over a socket 40 formed in asupport 30, the individual device overlying slot 92 may be installed. Asshown in FIGS. 12 and 13, ejector panel 98 includes a lower edge 108designed to contact a device 10 and to urge it through slot 92 and intosupport 30. Thus, upon depression of actuator 84 under manual force, asindicated at arrow 110 in FIG. 13, a single device 10 is slid from tray82 and guided into engagement with socket 40 and electrical socket 44 atthe base thereof The actuator may then be raised, the dispenserdisplaced, and a subsequent device installed. Sliding plate 100, incombination with compression spring 102 ensures that a subsequent deviceis indexed into place above slot 92 for such subsequent installation.

While the invention may be susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the followingappended claims.

1. A method for installing at least one electronic device of a pluralityof electronic devices in a support, the at least one electronic devicehaving first conductive elements configured to contact second conductiveelements in an interface region of the support, the method comprising:providing a dispenser with an electronic device holding tray, thedispenser retaining the plurality of electronic devices aligned withinthe tray and supported by a base; locating the base on the interfaceregion of the support; and activating an actuator to eject the at leastone electronic device from the tray through an opening in the base ontothe interface region to bring the first conductive elements into contactwith the second conductive elements.
 2. The method of claim 1,comprising inserting the plurality of electronic devices into the trayand aligning the devices within the tray using sidewalls of the tray andthe base, wherein the opening comprises a slot within the base forguiding the electronic device through the dispenser into the support. 3.The method of claim 2, comprising biasing the plurality of electronicdevices in a stack within the tray towards the slot with a compressionspring.
 4. The method of claim 2, wherein activating the actuatorcomprises inserting the actuator through the slot.
 5. The method ofclaim 1, comprising advancing a second electronic device of theplurality of electronic devices into an installation position within thetray.
 6. The method of claim 5, comprising ensuring proper alignment ofthe installation position with the interface region by aligningregistration elements disposed on the dispenser and on the support,wherein the installation position is located over the opening.
 7. Themethod of claim 1, comprising positioning the at least one electronicdevice within a socket of the support to form an electrical interfacewith a circuit board, wherein the support is electrically interfacedwith the circuit board and the support includes an insulative body withsidewalls and partitions defining the socket.